The iPS-240 power supply unit is made to be used exclusively with the STP-iX-455 Turbo-Molecular pump. The Communication port on the front side of the unit makes it possible to dock the iDT-001 display unit for complete control of your STP-iX-455 system. The STP-iX455 turbo-molecular pump utilizes a magnetic bearing and motor drive system and has an ultimate pressure of 1.3x10-10 Torr (8 in. O.D. conflat inlet). With its multi-axis magnetic bearing system contact between the rotor and the remainder of the pump is completely eliminated, effectively producing an unparalleled level of vibration and heat reduction. No frictional contact in the STP-iX455 also reduces wear and enables it to run virtually maintenance free for years. With an integrated controller eliminates the need for a conventional rack mounted controller. This is the Edwards iPS-240 external power supply only. 
The STP-iX455 has a built in automatic balancing system (ABS), a key feature of 5-axis magnetic drive technology. Sensors in the pump detect imbalance in the rotor motion and respond by adjusting the bearings magnetic fields to permit the rotor to spin on its own inertial axis, reducing vibration sent to the inlet flange. This function of the STP-iX455 works at all rotational speeds to ensure pump safety. All STP series pumps have dry lubricated radial and axial mechanical bearings as backup safety bearings. In the event of total failure of the magnetic bearings, these mechanical bearings will support the rotor and protect the pump. 
The STP-iX-455 can be connected directly to a terminal using a serial port and the STP-link Monitoring Software. The Software Displays, Rotational Speed, Motor Status, Temperature, Rotor balance status & Magnet bearing current. 
The STP-iX455 can be used for a variety of applications including but not limited to:

• Plasma etch (chlorine, fluorine and bromine chemistries) for metal (aluminum), tungsten and dielectric (oxide) and polysilicon
• Electron cyclotron resonance (ECR) etch
• Film deposition CVD, PECVD, ECRCVD, MOCVD
• Sputtering
• Ion implantation source, beam line pumping end station
• MBE
• Diffusion
• Photo resist stripping
• Crystal/epitaxial growth
• Wafer inspection
• Load lock chambers
• Scientific instruments: surface analysis, mass spectrometry, electron microscopy
• High energy physics: beam lines, accelerators
• Radioactive applications: fusion systems, cyclotrons